LIST OF FIGURES


Figures Page

1 The two basic methods of pattern transfer ............... .............2

2 Anisotropic etching ............ ........ .......... ..... ................. ......... 3

3 A sim ple plasm a reactor............................. ... ............ ......... .5

4 The plasma sheath ............. ... ................... ............... ........... .5

5 A schematic of the plasma reactor.................................... ............8

6 Sputtering versus chem ical etching .................................. ...............10

7 Non-directional versus directional etching................... ................... 11

8 Etch profiles due to increased chlorine flow ......... .................................11

9 Increased Ar flow increases etch depth and anisotropy of GaAs........................12

10 Increased pressure decreases etch rate ............................. ... ........... .. 13

11 Electron-beam Lithography apparatus ..... ......................................... 15

12 The develop ent of the pattern ............ ...................... ....................16

13 M etal evaporator...................................... ............. ........... 18

14 Optical microscope image of the gold star array on GaAs...........................18

15 AFM image and line scan plot of sample 1 unetched .............. ..............22

16 AFM image and line scan plot of sample 2 etched in chlorine/argon plasma......24

17 AFM image and line scan plot of sample 3 etched in chlorine/argon plasma......25

18 AFM image and line scan plot of sample 6 unetched...................... ...........26

19 AFM image and line scan plot of sample 5 etched in chlorine/argon plasma......27